PRODUCTS
DOPO
Details
Applications: Plastics for electronics, circuit board, linear polyester, polyamide, epoxy resin, polyurethane.
Molecular Formula:
specifications:
|
Item |
Index |
|
assay |
≥ 98%(HPLC) |
|
melting point |
116-119℃ |
|
boiling point |
200 ℃(phm) |
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